UV50 Solder Flux Paste for Soldering is made easier using rosin flux. Rosin soldering flux paste is noncorrosive, making it ideal for use with ICs and printed circuit boards.

Mechanic Flux Paste is PH-neutral and has a strong binding strength. Mobile phones, PC cards, and other high-tech electronic chip-level welding can all benefit from using Solder Gel. High-Tech, Synthetic, BGA Solder Paste, Flux Cream, Tin Rosin.

•  Insulating properties are high, welding surface is smooth, and ph value is neutral.
• Welding Electronic Chips on PC Cards Requires Professional-Grade Tin Flux.
• Having a boiling point just above solder’s melting point.
• Tools for welding and soldering are essential.
• IC and PCB for corrosion resistance
•  High capacity; use for PCB, BGA, SMD, PGA repair, Soldering, and other similar tasks; etc.
• Solder paste made from rosin.

BGA Soldering Grease Paste Tin Cream for Mobile Phone Technical Details:

• Size: 50g
• BGA solder flux cream based on rosin
• 0.4 Viscosity in pascals
• Granulometry 5: 0.22um
• Use Case 6: Repairing Phones by Soldering BGA Circuit Boards
• PC Card Chip-Level Electronic Welding 7